Patent Number: 7,355,853

Title: Module structure and module comprising it

Abstract: A module is provided that has high reliability in the junction between a ceramic circuit board and a heat sink, undergoes small changes in shape and warp of a module structure comprising a ceramic circuit board and a metal heat sink event under a temperature history during power module assembly and power module actual use, eliminates an unfavorableness during power module assembly, and maintains high reliability over a long period of time. A module structure characterized in that in a module member formed by bonding the ceramic circuit board to the metal heat sink via a metal plate (A) the main component of which is aluminum, the metal plate (A) has a thickness of 400 .mu.m or more and 1,200 .mu.m or less.

Inventors: Emoto; Hideyuki (Tokyo, JP), Ibukiyama; Masahiro (Tokyo, JP), Sugimoto; Isao (Tokyo, JP), Uto; Manabu (Tokyo, JP)

Assignee: Denki Kagaku Kogyo Kabushiki Kaisha

International Classification: H05K 7/20 (20060101)

Expiration Date: 2020-04-08 0:00:00