Patent Number: 7,355,863

Title: High frequency multilayer integrated circuit

Abstract: A high frequency multilayer integrated circuit is provided with: a multilayer board including n earth conductor layers (n: integer of two or more than two) and (n-1) dielectric layers each arranged between adjacent earth conductor layers; a first high frequency circuit disposed in one of the most outside earth conductor layers of the multilayer board; a first power-supply/control circuit disposed in this most outside earth conductor layer; a second high frequency circuit disposed in at least one of the dielectric layers and connected to the first high frequency circuit in the multilayer board; a second power-supply/control circuit disposed in another one of the most outside earth conductor layers of the multilayer board; and a third power-supply/control circuit disposed in at least one of the dielectric layers at a portion at which the second high frequency circuit does not exist, the third power-supply/control circuit being connected to the first and second power-supply/control circuits.

Inventors: Suzuki; Ryota (Sagamihara, JP), Nakada; Taihei (Yokosuka, JP), Kumamoto; Tsuyoshi (Yokohama, JP), Yamashita; Yuusuke (Yokohama, JP)

Assignee: Kabushiki Kaisha Toshiba

International Classification: H05K 1/11 (20060101); H05K 1/14 (20060101)

Expiration Date: 2020-04-08 0:00:00