Patent Number: 7,398,694

Title: Pressure sensor and method for manufacturing pressure sensor

Abstract: The present invention aims at providing a pressure sensor having excellent reliability in sealing a pressure reference chamber and a method for manufacturing the pressure sensor. A movable electrode is formed on an opposing surface side of a diaphragm formed on a pressure-receiving substrate, and an opposing electrode is formed on a region opposing the movable electrode on an opposing substrate. From the movable electrode, a conductive film, and a terminal wire on an inner surface of a through-hole are arranged as conductive wires (lead wires). In addition, from the opposing electrode, a lead wire, a conductive film opposing the lead wire and constructing a contact point, a conductive film and a terminal wire of a castellation are arranged as conductive wires. The pressure-receiving substrate and the opposing substrate are anodically bonded together via the conductive films and, and a specific region including the opposing surface side of the diaphragm is sealed.

Inventors: Watanabe; Jun (Suwa, JP)

Assignee: Seiko Epson Corporation

International Classification: G01L 9/00 (20060101)

Expiration Date: 2020-07-15 0:00:00