Patent Number: 7,399,061

Title: Bonding structure, actuator device and liquid-jet head

Abstract: A bonding structure including bonding wires having a diameter A, bonding pads to which the bonding wires are connected, and bonding portions which, as sites of connection, are arranged on a straight line, and wherein the pitch P of the bonding portions is set at XA+.sigma. or more where 1.80.ltoreq.X.ltoreq.2.1, A is as defined above, and .sigma. denotes a variation for the bonding procedure.

Inventors: Owaki; Hiroshige (Nagano-ken, JP), Miyata; Yoshinao (Nagano-ken, JP)

Assignee: Seiko Epson Corporation

International Classification: B41J 2/14 (20060101)

Expiration Date: 2020-07-15 0:00:00