Patent Number: 7,535,091

Title: Multichip stacking structure

Abstract: A multichip stacking structure is provided, including a chip carrier; a plurality of semiconductor chips stacked on the chip carrier in a stepped manner that an overlying chip mounted on an underlying chip of the plurality of semiconductor chips has a suspended portion free of being in contact with the underlying chip; and a bump mounted on the chip carrier at a position corresponding to a suspended side of the stacked semiconductor chips where the suspended portion of the overlying chip is located. The bump can serve as a blocking member or a filling member to prevent the semiconductor chips from delamination or formation of voids during a molding process.

Inventors: Sung; Chien-Chih (Taichung, TW), Wang; Chung-Pao (Taichung, TW), Ku; Yung-Chuan (Taichung Hsien, TW)

Assignee: Siliconware Precision Industries Co., Ltd.

International Classification: H01L 23/02 (20060101)

Expiration Date: 2021-05-19 0:00:00