Patent Number: 7,535,094

Title: Substrate structure, a method and an arrangement for producing such substrate structure

Abstract: The present invention relates to a substrate structure comprising at least two substrate layers extending in substantially parallel planes, which substrate layers are (Z-)interconnected in a direction substantially perpendicular to said planes. It comprises at least one adhesive film layer for interconnecting said at least two substrate layers, said adhesive film layer(s) comprising non-conductive portions and conductive portions. The position(s) of conductive portions is controllable such as to admit positioning of conductive portions at locations in the substrate layers where electrical conductivity is needed in a direction substantially perpendicular to the planar extension of, and between, two interconnected substrate layers.

Inventors: Tornqvist; H{dot over (a)}kan (Goteborg, SE), Johansson; Sophia (Goteborg, SE), Sjoberg; Malin (Molnlycke, SE), Axelsson; Klas (Askim, SE)

Assignee: Telefonaktiebolaget LM Ericsson (publ)

International Classification: H01L 23/12 (20060101)

Expiration Date: 2021-05-19 0:00:00