Patent Number: 7,535,111

Title: Semiconductor component with semiconductor chip and adhesive film, and method for its production

Abstract: A semiconductor component with a semiconductor chip and an adhesive film, and a method for its production is disclosed. In one embodiment, the semiconductor component has the adhesive film, which is internally prestressed and is adhesive on both faces, between the rear face of the semiconductor chip and a chip connecting surface on a circuit mount.

Inventors: Bauer; Michael (Nittendorf, DE), Chan; Kai Chong (Singapore, SG)

Assignee: Infineon Technologies AG

International Classification: H01L 23/48 (20060101); H01L 23/52 (20060101)

Expiration Date: 2021-05-19 0:00:00