Patent Number: 7,535,114

Title: Integrated circuit devices including compliant material under bond pads and methods of fabrication

Abstract: An integrated circuit device includes a die having an interconnect structure formed over a surface thereof. A volume of compliant material located within the interconnect structure underlies one or more bond pads disposed on an uppermost layer of the interconnect structure. The compliant material may absorb stresses exerted on the interconnect structure during assembly, testing, or subsequent operation. Other embodiments are described and claimed.

Inventors: Agraharam; Sairam (Phoenix, AZ), Manepalli; Rahul N. (Chandler, AZ)

Assignee: Intel Corporation

International Classification: H01L 29/40 (20060101)

Expiration Date: 2021-05-19 0:00:00