Patent Number: 7,535,164

Title: Self-emission panel and method of manufacturing same

Abstract: A self-emission panel and a method of manufacturing a self-emission panel which can prevent emission failures from occurring due to various factors, thereby achieving a self-emission panel that is free from emission failures. The self-emission panel is manufactured by forming a first conductive layer on a substrate directly or via other layers, forming a deposition layer including a luminescent layer on the first conductive layer, and forming a second conductive layer on the deposition layer. This manufacturing method includes: a first step of forming a sectioning layer for sectioning an opening for making a emission area on the first conductive layer after the formation of the first conductive layer; a second step of applying surface treatment to at least the surface of the first conductive layer inside the opening; and a third step of depositing a deposition layer on the first conductive layer given surface treatment in the second step.

Inventors: Nakajima; Shinji (Yamagata, JP), Nakajima; Yusuke (Yamagata, JP), Yuki; Toshinao (Yamagata, JP)

Assignee: Tohoku Pioneer Corporation

International Classification: H01L 51/54 (20060101); H01L 51/40 (20060101); H01L 51/56 (20060101); H01J 1/62 (20060101)

Expiration Date: 2021-05-19 0:00:00