Patent Number: 7,610,948

Title: Cooler module

Abstract: A non-welding cooler module includes a heat sink formed of a stack of radiation fins, a base block tightly fitted into the bottom side of the heat sink, heat pipes tightly inserted through the radiation fins and partially fitted into respective bottom open grooves of the base block with a respective flat wall portion thereof kept in flush with the bottom wall of the base block, and a thermal pad affixed to the bottom wall of the base block to hold down the heat pipes in the bottom open grooves of the base block for transferring heat energy from an external electronic chip to the heat pipes and the heat sink for quick dissipation.

Inventors: Huang; Tsung-Hsien (Hu Pei Village, Yuan Shan Hsiang, I-Lan Hsien, TW)

Assignee:

International Classification: H05K 7/20 (20060101)

Expiration Date: 1/03/02017