Patent Number: 7,611,400

Title: Smart conditioner rinse station

Abstract: A method and apparatus for monitoring polishing pad conditioning mechanisms is provided. In one embodiment, a semiconductor substrate polishing system includes a rinse station, a polishing surface, a conditioning element, and a conditioning mechanism. The conditioning mechanism selectively positions the conditioning element over the polishing surface and over the rinse station. At least one sensor is provided and is configured to detect a first position and a second position of the conditioning element when disposed over the rinse station.

Inventors: Yilmaz; Alpay (San Jose, CA), Karuppiah; Lakshmanan (San Jose, CA)

Assignee: Applied Materials, Inc.

International Classification: B24B 53/00 (20060101)

Expiration Date: 1/03/02017