Patent Number: 7,611,644

Title: Core-shell structure metal nanoparticles and its manufacturing method

Abstract: The present invention provides metal nanoparticles, containing copper core and thin layer of precious metals enclosing the core to prevent oxidization of copper, in which manufacturing the metal nanoparticles is economical efficiency because of increased copper content and since such metal nanoparticles contain a metal having high electrical conductivity such as silver for a thin layer, they can form a wiring having better conductivity than copper and there is little concern that silver migration may occur.

Inventors: Shim; In-Keun (Seoul, KR), Oh; Young-Soo (Seongnam-si, KR), Joung; Jae-Woo (Suwon-si, KR)

Assignee: Samsung Electro-Mechanics Co., Ltd.

International Classification: H01B 1/00 (20060101); B01J 13/02 (20060101); H01B 1/22 (20060101)

Expiration Date: 1/03/02017