Patent Number: 7,611,818

Title: Photosensitive resin composition, photosensitive element, resist pattern forming method and process for manufacturing printed circuit board

Abstract: A photosensitive resin composition comprising (A) a binder polymer, (B) a photopolymerizing compound with an ethylenic unsaturated bond, (C) a photopolymerization initiator and (D) a compound represented by the following general formula (1) or (2). [Chemical Formula 1] ##STR00001## [wherein X.sup.1, X.sup.2, X.sup.3, X.sup.4, X.sup.5 and X.sup.6 each independently represent a CH group, CCH.sub.3 group, CC.sub.2H.sub.5 group or nitrogen, Y.sup.1, Y.sup.2, Y.sup.3 and Y.sup.4 each independently represent optionally substituted aryl, and Y.sup.5 represents optionally substituted arylene].

Inventors: Sawabe; Ken (Hitachi, JP), Yori; Hanako (Hitachi, JP)

Assignee: Hitachi Chemical Company, Ltd.

International Classification: G03F 7/00 (20060101); G03F 7/004 (20060101)

Expiration Date: 1/03/02017