Patent Number: 7,611,919

Title: Bonding interface for micro-device packaging

Abstract: In one embodiment, a method for making a cover for a micro-device package includes forming a layer of silicon on a transparent substrate and selectively removing parts of the silicon layer to form a bonding ring and an alignment target.

Inventors: Sand; Kirby (Corvallis, OR), Haluzak; Charles C. (Corvallis, OR), Chen; Chien-Hua (Corvallis, OR)

Assignee: Hewlett-Packard Development Company, L.P.

International Classification: H01L 21/00 (20060101)

Expiration Date: 1/03/02017