Patent Number: 7,611,926

Title: Thermosetting die bonding film

Abstract: The thermosetting die bonding film of the invention is a thermosetting die bonding film used to produce a semiconductor device, which contains, as main components, 5 to 15% by weight of a thermoplastic resin component and 45 to 55% by weight of a thermosetting resin component, and has a melt viscosity of 400 Pas or more and 2500 Pas or less at 100.degree. C. before the film is thermally set.

Inventors: Takamoto; Naohide (Ibaraki, JP), Misumi; Sadahito (Ibaraki, JP), Matsumura; Takeshi (Ibaraki, JP), Amano; Yasuhiro (Ibaraki, JP), Oikawa; Masami (Kisarazu, JP), Miki; Tsubasa (Ibaraki, JP)

Assignee: Nitto Denko Corporation

International Classification: H01L 21/58 (20060101); H01L 23/14 (20060101)

Expiration Date: 1/03/02017