Patent Number: 7,611,927

Title: Method of minimizing kerf width on a semiconductor substrate panel

Abstract: A semiconductor die substrate panel is disclosed including a minimum kerf width between adjoining semiconductor package outlines on the panel, while ensuring electrical isolation of plated electrical terminals. By reducing the width of a boundary between adjoining package outlines, additional space is gained on a substrate panel for semiconductor packages.

Inventors: Liao; Chih-Chin (Changhua, TW), Ye; Ning (San Jose, CA), Yu; Cheemen (Madison, WI), Chien; Jack Chang (Koashiung, TW), Takiar; Hem (Fremont, CA)

Assignee: SanDisk Corporation

International Classification: H01L 21/332 (20060101)

Expiration Date: 1/03/02017