Patent Number: 7,612,385

Title: High power light-emitting diode package comprising substrate having beacon

Abstract: Disclosed herein is a package structure including at least one high power light-emitting diode to exhibit excellent heat release properties. In the package structure, a light-emitting diode chip which generates heat is directly attached to a beacon processed to protrude from part of a heat spreader having high heat conductivity, whereby an electrical wiring portion is separated from a heat release portion, thus maximizing heat release properties and realizing high luminance and reliability. The package structure is composed of a beacon formed on a metal or non-metal substrate having high heat conductivity to mount a high power light-emitting diode chip, to increase heat release properties; a wiring portion provided on the same line as the diode to input and output power and signals; and a reflection cup having a cavity, which may be inserted into or attached to the heat spreader or the wiring substrate, including a low temperature co-fired ceramic substrate, a high temperature co-fired ceramic substrate, or a printed circuit board.

Inventors: Kim; Young-Woo (Gwangsan-gu, KR), Kim; Tae-Hoon (Buk-gu, KR), Yu; Young-Moon (Yuseong-gu, KR)

Assignee: Korea Photonics Technology Institute

International Classification: H01L 29/22 (20060101); H01L 23/02 (20060101); H01L 29/267 (20060101); H01L 33/00 (20060101); H01L 31/12 (20060101); H01L 27/15 (20060101); H01L 29/16 (20060101)

Expiration Date: 1/03/02017