Patent Number: 7,612,434

Title: Electronic device having wiring substrate and lead frame

Abstract: An electronic device includes: a first substrate and a second substrate; a lead frame disposed between the first and the second substrates for electrically connecting therebetween; and a first groove and a second groove disposed on the first and the second substrates, respectively. The first and the second grooves correspond to a connection portion between the first and the second substrates and the lead frame. The lead frame is connected to the first and the second substrates in such a manner that one end of the lead frame is engaged in both of the first and the second grooves through a conductive bonding material.

Inventors: Imaizumi; Norihisa (Hoi-gun, JP), Sanada; Yuuki (Nukata-gun, JP), Ishikawa; Takeshi (Nishikasugai-gun, JP)

Assignee: Denso Corporation

International Classification: H01L 23/495 (20060101); H01L 23/02 (20060101)

Expiration Date: 1/03/02017