Patent Number: 7,612,446

Title: Structures to enhance cooling of computer memory modules

Abstract: A spring-like cooling structure for an in-line chip module is formed from a continuous sheet of a thermally conducting material having a front side and a back side, the sheet folded at substantially a one-hundred and eighty degree angle, wherein a length of the structure substantially correlates to a length of the in-line chip module, and a width of the structure is wider than a width of the in-line chip module such that the structure fits over and substantially around the in-line chip module; openings at a left-side, right-side and a bottom of the structure for easily affixing and removing the structure from the in-line chip module; a top part comprising a top surface disposed over a top of the in-line chip module when affixed to the in-line chip module, and comprising an angled surface flaring outward from the in-line chip module, the angled surface positioned directly beneath the top surface; a center horizontal part; a gap between the center horizontal part and the plurality of chips; and a flared bottom area of the structure.

Inventors: Dang; Hien P. (Nanuet, NY), Kamath; Vinod (Raleigh, NC), Khanna; Vijayeshwar D. (Millwood, NY), McVicker; Gerard (Stormville, NY), Sri-Jayantha; Sri M. (Ossining, NY), Yoon; Jung H. (Poughkeepsie, NY)

Assignee: International Business Machines Corporation

International Classification: H01L 23/34 (20060101); F28F 7/00 (20060101); H05K 7/20 (20060101); H01L 21/00 (20060101)

Expiration Date: 1/03/02017