Patent Number: 7,612,458

Title: Epoxy resin composition for semiconductor encapsulating use, and semiconductor device

Abstract: There is provided an epoxy resin composition for semiconductor encapsulating use comprising: an epoxy resin (A); a phenol resin (B); a curing accelerator (C); and an inorganic filler (D), wherein the inorganic filler (D) contains a spherical fused silica (d1) which contains: metal or semimetal other than silicon; and/or an inorganic compound comprising the metal or semimetal other than silicon.

Inventors: Nakamura; Atsushi (Tochigi, JP)

Assignee: Sumitomo Bakelite Company Limited

International Classification: H01L 23/29 (20060101); B32B 27/04 (20060101); B32B 27/20 (20060101); B32B 27/38 (20060101); C08K 3/34 (20060101); C08L 63/00 (20060101)

Expiration Date: 1/03/02017