Patent Number: 7,615,707

Title: Printed circuit board and forming method thereof

Abstract: A printed circuit board and a forming method for forming the printed circuit board are disclosed. The printed circuit board includes a substrate and a conductive layer. The substrate includes a through hole, wherein one side of the through hole of the substrate corresponds to a first diameter, and the other side of the through hole of the substrate corresponds to a second diameter. The second diameter is greater than the first diameter. The conductive layer is placed on the inner surface of the through hole for electrically connecting the two sides of the substrate.

Inventors: Lin; Yung-Jen (Taipei, TW)

Assignee: Lite-On Technology Corp.

International Classification: H05K 1/11 (20060101); H01R 12/04 (20060101)

Expiration Date: 2022-11-10 0:00:00