Patent Number: 7,615,833

Title: Film bulk acoustic resonator package and method of fabricating same

Abstract: A microfabricated device has a first substrate, a second substrate, a film bulk acoustic resonator (FBAR) device, and a circuit. The second substrate is bonded to the first substrate to define a chamber. The FBAR device is located on a surface of the first substrate and inside the chamber. The circuit is located on a surface of the second substrate and inside the chamber. An electrical connection connects the circuit and the FBAR device.

Inventors: Larson, III; John D. (Palo Alto, CA), Bai; Qing (Sunnyvale, CA), Matta; Farid (Los Altos, CA), Verhoeven; Tracy (San Jose, CA)

Assignee: Avago Technologies Wireless IP (Singapore) Pte. Ltd.

International Classification: H01L 41/00 (20060101)

Expiration Date: 2022-11-10 0:00:00