Patent Number: 7,707,712

Title: Apparatus for assembling camera module

Abstract: Provided is an apparatus for assembling a camera module comprising a support frame that is formed in a rectangular shape and has a jig horizontally connected to an upper end thereof; a plurality of stages that are vertically stacked and installed in the support frame and adjust a printed circuit board (PCB) in three-axis directions; a board holder that is formed to extend from one end of the uppermost stage and has the PCB mounted on the extending end thereof; and a jig assembly that is disposed on an opening of the jig and has a barrel-integrated housing mounted on the central portion thereof.

Inventors: Kim; Duck Hun (Suwon, KR)

Assignee: Samsung Electro-Mechanics Co., Ltd.

International Classification: H05K 3/30 (20060101)

Expiration Date: 5/04/12018