Patent Number: 7,707,715

Title: Method of fabricating multilayer printed circuit board

Abstract: Disclosed is a method of fabricating a multilayer printed circuit board, which enables the formation of a micro circuit able to be realized through a semi-additive process using the CTE and rigidity of a metal carrier on a thin substrate which is difficult to convey.

Inventors: Okabe; Shuhichi (Gyunggi-do, KR), Yoo; Je Gwang (Gyunggi-do, KR), Ryu; Chang Sup (Gyunggi-do, KR), Kang; Myung Sam (Daejeon, KR), Park; Jung Hyun (Gyunggi-do, KR), Jo; Ji Hong (Chungcheongnam-do, KR), An; Jin Yong (Daejeon, KR), Jung; Soon Oh (Gyunggi-do, KR)

Assignee: Samsung Electro-Mechanics, Co., Ltd.

International Classification: H05K 3/00 (20060101)

Expiration Date: 5/04/12018