Patent Number: 7,708,618

Title: Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device

Abstract: A polishing apparatus includes an arrangement of a plurality of units to deal with various operations and a robot having at least one arm. The plurality of units are disposed around the robot and include a loading unit for receiving thereon a, e.g. dry, workpiece to be polished, a polishing system including at least one polishing unit for polishing the workpiece, a washing system and a drying system at least including one washing unit for washing and drying the polished workpiece, and an unloading unit for receiving thereon a resultant clean and dry polished workpiece.

Inventors: Yajima; Hiromi (Yokohama, JP), Imoto; Yukio (Zama, JP), Kodama; Shoichi (Shinagawa-ku, JP), Aoki; Riichiro (Adachi-ku, JP), Omichi; Takashi (Fujisawa, JP), Nishi; Toyomi (Tokyo, JP), Togawa; Tetsuji (Tokyo, JP)

Assignee: Ebara Corporation

International Classification: B24B 51/00 (20060101)

Expiration Date: 5/04/12018