Patent Number: 7,708,920

Title: Conductively doped resin moldable capsule and method of manufacture

Abstract: A method to form moldable capsules of a conductively doped resin-based material is realized. The method comprises compressing a bundle of micron conductive fiber strands by passing the bundle through a compressing ring. A resin-based material is extruded/pultruded onto the compressed bundle. The resin-based material and the bundle are sectioned into moldable capsules. The micron conductive fiber comprises between about 20% and about 50% of the total weight of each moldable capsule.

Inventors: Aisenbrey; Thomas (Littleton, CO)

Assignee: Integral Technologies, Inc.

International Classification: B29C 47/02 (20060101); B32B 15/08 (20060101)

Expiration Date: 5/04/12018