Patent Number: 7,709,177

Title: Multilayered resist systems using tuned polymer films as underlayers and methods of fabrication thereof

Abstract: Multilayered resist structures including bilayer and top surface imaging which utilize tuned underlayers functioning as ARCs, planarizing layers, and etch resistant hard masks whose properties such as optical, chemical and physical properties are tailored to give a multilayer resist structure exhibiting high resolution, residue free lithography and methods of preparing these materials.

Inventors: Angelopoulos; Marie (Cortlandt Manor, NY), Babich; Katherina E. (Chappaqua, NY), LaTulipe; Douglas Charles (Danbury, CT), Lin; Qinghuang (Mohegan Lake, NY), Medeiros; David R. (Dobbs Ferry, NY), Moreau; Wayne Martin (Wappingers Falls, NY), Petrillo; Karen E. (Mahopac, NY), Simons; John P. (Wappingers Falls, NY)

Assignee: International Business Machines Corporation

International Classification: G03F 7/004 (20060101); G03F 7/30 (20060101)

Expiration Date: 5/04/12018