Patent Number: 7,709,183

Title: Method and device for manufacturing relief printing plate terminal for seamless printing

Abstract: A workpiece 70 is set to holding rotating means and then liquid-state photosensitive resin 10 is supplied to a resin applying smoothing unit 150 to mold the workpiece 70 into a uniform thickness while rotating the workpiece 70 and applying the liquid-state photosensitive resin 10 to the outer periphery of the workpiece 70 by the resin applying smoothing unit 150. Moreover, while rotating the workpiece 70, liquid-state photosensitive resin, it is exposed by high-intensity ultraviolet light 30 and thereby, the surface of the photo-cured photosensitive resin is shaped to remove an unnecessary resin layer. Then, laser carving is performed by an infrared laser beam 40 to perform post-treatment.

Inventors: Watanabe; Miyoshi (Fuji, JP), Kishida; Tomohiro (Fuji, JP)

Assignee: Asahi Kasei Chemicals Corporation

International Classification: G03F 7/26 (20060101)

Expiration Date: 5/04/12018