Patent Number: 7,709,283

Title: Method of manufacturing a semiconductor device having an insulating protective film covering at least a portion of a tile-shaped element

Abstract: The invention provides a semiconductor device, a method of manufacturing the same, an electro-optic device and an electronic apparatus which are capable of addressing or solving a problem of mechanical mounting of a semiconductor element chip on a substrate. A semiconductor device includes a tile-shaped microelement bonded to a substrate, and an insulating functional film provided to cover at least a portion of the tile-shaped microelement.

Inventors: Kondo; Takayuki (Suwa, JP)

Assignee: Seiko Epson Corporation

International Classification: H01L 21/00 (20060101)

Expiration Date: 5/04/12018