Patent Number: 7,709,294

Title: Die attach area cut-on-fly method and apparatus

Abstract: A method and apparatus for bonding integrated circuits uniquely suited to high volume tag production is described, where conductive material of a substrate at the die-attach-area is cut before an IC chip or transponder is placed on the conductive material over the cut and bonded. The apparatus performs the method of placing a first chip on a substrate having a conductive layer, measuring the location of the first chip on the substrate, cutting the conductive layer at a location of an expected subsequently placed chip to form a cut based on the measured location of the first chip, and placing the subsequently placed chip on the substrate over the cut.

Inventors: Clare; Thomas J. (Media, PA), Cote; Andre (Williamstown, NJ), Eckstein; Eric (Merion Station, PA)

Assignee: Checkpoint Systems, Inc.

International Classification: H01L 21/00 (20060101); B23K 20/00 (20060101)

Expiration Date: 5/04/12018