Patent Number: 7,709,352

Title: In-place bonding of microstructures

Abstract: A method for bonding microstructures to a semiconductor substrate using attractive forces, such as, hydrophobic, van der Waals, and covalent bonding is provided. The microstructures maintain their absolute position with respect to each other and translate vertically onto a wafer surface during the bonding process. The vertical translation of the micro-slabs is also referred to herein as "in-place bonding". Semiconductor structures which include the attractively bonded microstructures and substrate are also disclosed.

Inventors: Cohen; Guy M. (Mohegan Lake, NY), Mooney; Patricia M. (Mount Kisco, NY), Paruchuri; Vamsi K. (New York, NY)

Assignee: International Business Machines Corporation

International Classification: H01L 21/784 (20060101)

Expiration Date: 5/04/12018