Patent Number: 7,709,554

Title: Resin composition, resin cured product, and liquid discharge head

Abstract: An epoxy resin composition, including: an epoxy resin (A) represented by Formula (1); an epoxy resin (B) having an epoxy equivalent of 220 or less and having twice or more epoxy groups in a molecule than epoxy groups of the epoxy resin (A); and a photocationic polymerization initiator (C), in which: the epoxy resins (A) and (B) constitute main components; and a weight of the epoxy resin (A) is 40% or more and a weight of the epoxy resin (B) is 30% or more with respect to a total weight of the epoxy resins (A) and (B): ##STR00001## where: R represents a hydrogen atom, a methyl group, an ethyl group, a propyl group, or a t-butyl group; n represents an integer of 0 or more and 4 or less; and m represents an integer of 1 or more and 3 or less.

Inventors: Otaka; Shimpei (Yokohama, JP), Ishizuka; Kazunari (Suntoh-gun, JP), Horiuchi; Isamu (Kawasaki, JP), Imamura; Isao (Kawasaki, JP)

Assignee: Canon Kabushiki Kaisha

International Classification: C08F 2/50 (20060101); C08F 2/46 (20060101); C08J 3/28 (20060101)

Expiration Date: 5/04/12018