Patent Number: 7,709,744

Title: Gas venting component mounting pad

Abstract: Venting for component mounting pads of surface mount circuit boards allows the escape of gases from the junction between an electrical component and its associated mounting pad during soldering and facilitates a more complete and effective solder joint between the component base and pad. The venting may be accomplished by either one or more through holes in the board through the pads to allow undesirable gases to escape to the underside of the board, or by one or more solder free channels formed in the pad to allow the gases to escape through the periphery of the pad.

Inventors: Schaefer; Richard C. (Hillsboro, OR), Pollock; Steven (Hillsboro, OR), Bailley; Charles M. (Beaverton, OR), Lowe; Mike (Aloha, OR), Balk; Andrew J. (Beaverton, OR), Oldendorf; John G. (Portland, OR)

Assignee: Intel Corporation

International Classification: H05K 1/00 (20060101)

Expiration Date: 5/04/12018