Patent Number: 7,709,792

Title: Three-dimensional imaging using electron beam activated chemical etch

Abstract: Methods and apparatus for imaging a structure and a related processor-readable medium are disclosed. A surface of a substrate (or a portion thereof) is exposed to a gas composition. The gas composition includes one or more components that etch the substrate upon activation by interaction with a beam of electrons. A beam of electrons is directed to one or more portions of the surface of the substrate that are exposed to the gas composition to etch the one or more portions. A plurality of images is obtained of the one or more portions at different instances of time as the one or more portions are etched. A three-dimensional model of one or more structures embedded within the one or more portions of the substrate is generated from the plurality of images.

Inventors: Naser-Ghodsi; Mehran (Hamilton, MA), Chuang; Tzu-Chin (Cupertino, CA), Krzeczowski; Kenneth (Scotts Valley, CA), Lent; Matthew (Livermore, CA), Huang; Chris (Cupertino, CA), Borowicz; Stanislaw Marek (San Jose, CA)

Assignee: KLA-Tencor Technologies Corporation

International Classification: H01J 37/28 (20060101); G01N 23/225 (20060101); H01J 37/305 (20060101)

Expiration Date: 5/04/12018