Patent Number: 7,709,814

Title: Apparatus and process for treating dielectric materials

Abstract: Apparatuses and processes for treating dielectric materials such as low k dielectric materials, premetal dielectric materials, barrier layers, and the like, generally comprise a radiation source module, a process chamber module coupled to the radiation source module; and a loadlock chamber module in operative communication with the process chamber and a wafer handler. The atmosphere of each one of the modules can be controlled as may be desired for different types of dielectric materials. The radiation source module includes a reflector, an ultraviolet radiation source, and a plate transmissive to the wavelengths of about 150 nm to about 300 nm, to define a sealed interior region, wherein the sealed interior region is in fluid communication with a fluid source.

Inventors: Waldfried; Carlo (Falls Church, VA), Garmer; Christopher (Rockville, MD), Escorcia; Orlando (Falls Church, VA), Berry, III; Ivan (Ellicott City, MD), Sakthivel; Palani (Odenton, MD), Janos; Alan C. (Darnestown, MD)

Assignee: Axcelis Technologies, Inc.

International Classification: G21K 5/00 (20060101)

Expiration Date: 5/04/12018