Patent Number: 7,709,934

Title: Package level noise isolation

Abstract: A package may include a substrate provided with noise absorbing material. The noise absorbing material may absorb noise from a signal path in the substrate to prevent the noise from reaching other signals or signal paths.

Inventors: Zeng; Xiang Yin (Shanghai, CN), He; Jiangqi (Chandler, AZ), Zheng; Guizhen (Phoenix, AZ)

Assignee: Intel Corporation

International Classification: H01L 23/552 (20060101); H01L 23/053 (20060101); H01L 23/12 (20060101); H01L 23/62 (20060101); H01L 29/40 (20060101); H01L 23/58 (20060101); H01L 23/48 (20060101); H01L 23/52 (20060101)

Expiration Date: 5/04/12018