Patent Number: 7,709,963

Title: Audio power amplifier package

Abstract: An audio power amplifier package includes a non-signal lead, a first non-signal pad, a second non-signal pad and a plurality of bonding wires. The first non-signal pad and the second non-signal pad are disposed on a substrate. The bonding wires connect the non-signal lead to the first non-signal pad and the second non-signal pad respectively.

Inventors: Wu; Kuo-Hung (Sinshih Township, Tainan County, TW), Li; Po-Yu (Sinshih Township, Tainan County, TW)

Assignee: Himax Analogic, Inc.

International Classification: H01L 23/12 (20060101)

Expiration Date: 5/04/12018