Patent Number: 7,713,776

Title: Method of making a light emitting diode

Abstract: A method of making a light emitting diode includes forming a plurality of electrically conductive members at intervals on a first surface of an epitaxial layer which generates light so that the electrically conductive members are in ohmic contact with the epitaxial layer, forming a light incident layer on the first surface at regions where none of the electrically conductive members are formed, forming a light reflecting layer on the light incident layer and the electrically conductive members, providing an adhesive on the light reflecting layer, and bonding a permanent substrate to the light reflecting layer through the adhesive and through a wafer bonding process.

Inventors: Horng; Ray-Hua (Taichung City, TW), Wuu; Dong-Sing (Taichung, TW)

Assignee: Horng; Ray-Hua

International Classification: H01L 21/00 (20060101); H01L 21/40 (20060101)

Expiration Date: 5/11/12018