Patent Number: 7,713,781

Title: Methods for forming quad flat no-lead (QFN) packages

Abstract: Methods are provided for forming Quad Flat No-Lead (QFN) packages. An embodiment includes disposing an active side of a semiconductor chip on a plurality of leads, coupling a plurality of wire bonds to the active side of the semiconductor chip, coupling the plurality of wire bonds to the plurality of leads in a space between the active side and the plurality of leads, and encasing the semiconductor chip, at least a portion of each of the plurality of leads, and the plurality of wire bonds in a mold material to define a mounting side of the QFN package. The mounting side has a perimeter, the plurality of leads are oriented on and exposed on the mounting side within the perimeter, and the plurality of wire bonds are oriented between the active side and the mounting side within the mold material.

Inventors: Wang; James J. (Phoenix, AZ), McDonald; William G. (Scottsdale, AZ)

Assignee: Freescale Semiconductor, Inc.

International Classification: H01L 23/02 (20060101)

Expiration Date: 5/11/12018