Patent Number: 7,713,790

Title: Method and system of tape automated bonding

Abstract: A tape automated bonding (TAB) structure which includes a flex tape having a conductive lead pattern formed thereon. The conductive lead pattern includes a plurality of leads configured to form an inner lead bond (ILB) portion of the TAB structure. At least one of the plurality of leads is internally routed and has a contact exposed interior to the ILB portion of the TAB structure.

Inventors: Youker; Nick A. (River Falls, WI), Anderson; Ronald L. (Lino Lakes, MN), Hansen; John E. (Coon Rapids, MN)

Assignee: Cardiac Pacemakers, Inc.

International Classification: H01L 21/44 (20060101); H01L 21/48 (20060101)

Expiration Date: 5/11/12018