Patent Number: 7,714,234

Title: Alternating micro-vias and throughboard vias to create PCB routing channels in BGA interconnect grid

Abstract: A printed circuit board (PCB) assembly having a plurality of circuit layers including outer layers and intervening layers with through-vias and micro-vias used to translate a portion of the signal connections of the grid, thereby creating a set of diagonal routing channels between the vias on internal layers of the board and a BGA package mounted on the printed circuit board.

Inventors: Brown; Paul James (Wakefield, CA)

Assignee: Alcatel Lucent

International Classification: H01R 12/04 (20060101); H05K 1/11 (20060101)

Expiration Date: 5/11/12018