Patent Number: 7,714,336

Title: LED device and method by which it is produced

Abstract: A LED device formed of LED chips bonded to an exoergic member by the LED chips being bonded to an Au--Sn alloy layer formed on an upper surface of the exoergic member with columnar crystals being formed within the Au--Sn alloy layer extending in a direction perpendicular to the upper surface of the exoergic member. The method of producing the LED device forms an Sn film directly on the upper surface of the exoergic member, an Au film on a lower surface of the LED chips, mounts the LED chips with the Au film thereon onto the Sn film formed on the upper surface of the exoergic member, and the exoergic member with LED chips mounted thereon is heated in an atmosphere in which a forming gas flows, so that the LED chips are bonded to the exoergic member.

Inventors: Imai; Yuji (Kanzaki-gun, JP)

Assignee: Ushiodenki Kabushiki Kaisha

International Classification: H01L 33/00 (20100101)

Expiration Date: 5/11/12018