Patent Number: 7,715,196

Title: Mounting device for chips

Abstract: A mounting device for chips has a heat sink and at least one clamp. The heat sink has at least one conductive side, two ends, multiple chip units and two connecting bases. The chip units are arranged on the at least one conductive side. The connecting bases are formed on the ends of the heat sink. The at least one clamp is mounted across the at least one conductive side of the heat sink and has two ends, a middle sheet, multiple pressing tabs and two connecting arms. The pressing tabs extend from the middle sheet to press the chip units against the conductive side of the heat sink. The connecting arms are formed respectively on the ends of the clamp and are mounted respectively on the connecting bases.

Inventors: Chen; Jung-Fa (Taipei Hsien, TW), Tsai; Chu-Cheng (Taipei Hsien, TW)

Assignee: Acbel Polytech Inc.

International Classification: H05K 7/20 (20060101); F28F 7/00 (20060101); H01L 23/34 (20060101)

Expiration Date: 5/11/12018