Patent Number: 7,732,712

Title: Wiring board and method for manufacturing the same

Abstract: A wiring board includes: a semiconductor chip; an insulating layer in which the semiconductor chip is embedded; a wiring connected to the semiconductor chip; and reinforcing layers for reinforcing the insulating layer, the reinforcing layers respectively formed on a front face side of the insulating layer and a rear face side of the insulating layer.

Inventors: Yamano; Takaharu (Nagano, JP)

Assignee: Shinko Electric Industries Co., Ltd.

International Classification: H05K 1/16 (20060101)

Expiration Date: 2022-06-08 0:00:00