Patent Number: 7,732,929

Title: Power semiconductor component with semiconductor chip stack in a bridge circuit and method for producing the same

Abstract: A power semiconductor component (30) with power semiconductor chip stack (14) has a base power semiconductor chip (16) and a power semiconductor chip (17) stacked on the rear side of the base power semiconductor chip (16), a rewiring structure for the electrical coupling of the power semiconductor chips being arranged within the rear side metallization.

Inventors: Otremba; Ralf (Kaufbeuren, DE), Schloegel; Xaver (Sachsenkam, DE)

Assignee: Infineon Technologies AG

International Classification: H01L 25/07 (20060101); H01L 23/48 (20060101); H01L 23/52 (20060101)

Expiration Date: 2022-06-08 0:00:00