Patent Number: 7,737,363

Title: Halogen-free resin composition, covered wire covered with that and wiring harness with at least one above covered wire

Abstract: A halogen-free resin composition for a covered wire and a wiring harness which has a base resin composition of 100 weight division having 45 to 65% by weight of a polypropylene resin, 15 to 30% by weight of a low-density polyethylene resin, 15 to 30% by weight of a styrene thermoplastic elastomer, and a metal hydrate of 80-120 weight division. The styrene thermoplastic elastomer of the composition is an aromatic vinyl-conjugated diene system block copolymer and with a peak temperature of dynamic factor (tan .delta.) thereof measured in a range from -100 to C. by a dynamic viscoelasticity measurement device being made in C.

Inventors: Kambe; Makoto (Shizuoka, JP)

Assignee: Yazaki Corporation

International Classification: H01B 7/00 (20060101)

Expiration Date: 2022-06-15 0:00:00