Patent Number: 7,761,980

Title: Method of manufacturing a wiring substrate for ejection head

Abstract: The method manufactures a wiring substrate. The method comprises: a recess section forming step of forming recess sections corresponding to a prescribed wiring pattern, on a substrate; a filling step of filling a conductive paste containing thinner, into the recess sections; a curing step of causing the conductive paste filled in the recess sections in the filling step to contract, by drying and curing; and a plating step of forming a wiring conductor serving as the wiring pattern, by performing a plating process using the conductive paste in contact with at least a portion of an inner circumferential face of the recess sections, as at least one of a catalyst and a current feed layer.

Inventors: Ota; Hiroshi (Kanagawa, JP)

Assignee: Fujifilm Corporation

International Classification: H01R 43/00 (20060101); H05K 1/00 (20060101); B41J 2/015 (20060101)

Expiration Date: 7/27/12018