Patent Number: 7,784,664

Title: Fill head for injection molding of solder

Abstract: A system, method, and apparatus for injection molding conductive bonding material into a plurality of cavities in a surface are disclosed. The method comprises aligning a fill head with a surface. The mold includes a plurality of cavities. The method further includes placing the fill head in substantial contact with the surface. At least a first gas is channeled about a first region of the fill head. The at least first gas has a temperature above a melting point of conductive bonding material residing in a reservoir thereby maintaining the conductive bonding material in a molten state. The conductive bonding material is forced out of the fill head toward the surface. The conductive bonding material is provided into at least one cavity of the plurality of cavities contemporaneous with the at least one cavity being in proximity to the fill head.

Inventors: Cordes; Steven A. (Yorktown Heights, NY), Gruber; Peter A. (Mohegan Lake, NY), Knickerbocker; John U. (Monroe, NY), Speidell; James L. (Poughquag, NY)

Assignee: International Business Machines Corporation

International Classification: B23K 37/00 (20060101); B23K 31/02 (20060101)

Expiration Date: 8/31/12018