Patent Number: 7,784,764

Title: Low-adhesion material, mold for molding resin using the same and contaminant adhesion preventing material

Abstract: A low-adhesion material containing a rare-earth element is formed as a layer or a film on a mold surface of a mold for molding a resin. A main component of the low-adhesion material is a rare-earth compound, and Y.sub.2O.sub.3 is used as an example. A content of the rare-earth compound in the low-adhesion material is not less than 40 percent by volume. Thereby, a mold for molding a resin having excellent releasability can be obtained.

Inventors: Kuno; Takaki (Kyoto, JP), Noguchi; Yoshinori (Kyoto, JP), Maeda; Keiji (Kyoto, JP), Suda; Seiichi (Nagoya, JP), Kitaoka; Satoshi (Nagoya, JP), Kawashima; Naoki (Nagoya, JP), Yoshiya; Masato (Nagoya, JP)

Assignee: Towa Corporation

International Classification: B29C 33/38 (20060101); B32B 3/24 (20060101)

Expiration Date: 8/31/12018