Patent Number: 7,784,908

Title: Flexible film wiring board and liquid discharge head

Abstract: In a flexible wiring board for use in, for example, a liquid discharge head, wires disposed on a substrate in parallel are covered with a film material. The flexible wiring board is bendable towards one of a front surface side and a back surface side of the substrate and includes a bending line. The bending line is formed by bending the flexible wiring board along a bending direction crossing a longitudinal direction of the wires. The bending line contains the wires. Both ends of the flexible wiring board in the bending direction are located on the bending line. A distance between one of the wires located closest to one end of the flexible wiring board and the one end is larger on the bending line than in another part of the flexible wiring board. Accordingly, even if the flexible wiring board is bent at a small bend radius, peeling does not easily occur between a base film and a cover film.

Inventors: Umeyama; Mikiya (Tokyo, JP), Koizumi; Yutaka (Yokohama, JP), Yamaguchi; Yukuo (Tokyo, JP), Goto; Akira (Yokohama, JP), Iketani; Masaru (Atsugi, JP), Akama; Yuichiro (Kawasaki, JP)

Assignee: Canon Kabushiki Kaisha

International Classification: B41J 2/14 (20060101); B41J 2/16 (20060101)

Expiration Date: 8/31/12018